Quinnipiac University Summer Ct Invention Convention Camp 2026

In partnership with the Connecticut Invention Convention, middle school students from across the US will have the opportunity to dive deep into the invention and entrepreneurship process, from problem definition through ideation to a design and prototype. The camp will culminate with the exciting Invention Convention event where students will present their inventions. Students will leave the camp with their invention, a prototype, a provisional patent, and the possibility to be invited to compete in the state finals in 2023! Over the span of 2 weeks, students will develop creative problem-solving and critical thinking skills through STEM experiential learning, invention projects and entrepreneurship challenges. Students will follow a framework of the innovation process. From problem definition to ideation to engineering design through to prototype, the program enables students to understand invention at a fundamental level and its importance in our everyday lives. At the end of the program, students will have the opportunity to present their invention at our very own Invention Convention and return home with their invention, a prototype and a provisional patent. Program Costs Two-week program includes these two options which are: Option 1: Residential overnight option, includes full room & board, as well as evening and weekend activities: $2,856 Option 2: Weekday commuter student (Monday-Friday 9 a.m. to 4:30 p.m.) lunch included: $2,160 Both options include: Two weeks of programming that are faculty-designed and delivered All program materials All technology and software support Quinnipiac T-shirt Certificate of completion Special Quinnipiac Admissions events Partial financial support may be available for those who indicate the need for financial assistance in their online application. Financial support awards are based on a combination of financial need and academic merit. This website uses cookies to ensure you get the best experience on our website.